Non-destructive Technology

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  • DualBeam™ Instruments
    Thứ năm, 06/06/2013

    <p><strong>FIB/SEMs for sample prep and microanalysis</strong></p>
    <p>FEI's DualBeam™ (FIB/SEM) systems are the preferred solution for 3D  microscopy and analysis serving material characterization, industrial  failure analysis and process control applications. They are designed to  deliver integrated sample preparation and microanalysis below 1nm for  high throughput semiconductor and data storage fabs and materials  science and life science labs.</p>

    Quanta 3D
    Our most versatile DualBeam for 2D and 3D materials characterization and analysis, the Quanta 3D features three SEM imaging modes (high vacuum, low vacuum and Environmental SEM) to accommodate the widest range of samples of any SEM. Integrated focused ion beam (FIB) adds cross sectioning capabilities to expand your applications range. ESEM mode allows in situ study of the dynamic behavior of materials at different humidity levels (up to 100% RH) and temperatures (up to 1500° C).


    Versa 3D
    Building on the history and success of FEI's pioneering DualBeam, low vacuum and ESEM™ expertise, FEI introduces their most versatile DualBeam instrument to date. The Versa 3D offers state-of-the-art imaging and analytical performance to deliver a greater range of 3D data from even your most challenging samples.


    Helios NanoLab
    The Helios NanoLab™ provides outstanding imaging with a novel electron beam column that includes, along with a complete suite of detectors, a new imaging chain that achieves superb contrast and resolution, while the focused ion beam's (FIB) superior performance provides fast milling and sample preparation applications.